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Board, Wafer & Die Inspection
PCB, BGA, AOI/AXI, ball-wedge and wire bonding machines: HALCON recognizes defects with an accuracy better than 1 µm.
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Board, Wafer & Die InspectionPCB, BGA, AOI/AXI, ball-wedge and wire bonding machines: HALCON recognizes defects with an accuracy better than 1 µm.
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