Board, Wafer & Die Inspection

Today's microelectronic industry makes heavy use of machine vision. By obtaining, for example, the correct position of a pad on a die and measuring its properties you get all the information you need to ensure the quality of your production process. HALCON is the machine vision software with which you can perform such tasks and even more.

With HALCON, the detection of missing solder becomes easy. BGA (ball grid array) inspection tasks are performed in real-time with highest accuracy by applying subpixel precise algorithms.