Our software packages offer robust and reliable methods and features for inspection applications in all industries.
Board, Wafer & Die Inspection
PCB, BGA, AOI/AXI, ball-wedge and wire bonding machines: Our software recognizes defects with an accuracy better than 1 µm.
Different materials, different error classes like holes, wrinkles, edge cracks, inclusions, contaminants, coating voids, scratches, spots, and dents: Our advanced filtering techniques are tailored to your needs. The easy-to-use texture inspection even adjusts necessary parameters automatically.
Labels and forms printed on paper, plastic, or metal by any kind of printer: MVTec software automatically compares trained patterns with your prints. Moreover, our software provides data code print quality inspection according to ISO/IEC 15415.
Insufficient soldering paste, missing diodes, rotated components: our software detects all incomplete or incorrectly positioned parts within milliseconds.