Our software packages offer robust and reliable methods and features for inspection applications in all industries.
Board, Wafer & Die Inspection
PCB, BGA, AOI/AXI, ball-wedge and wire bonding machines: Our software recognizes defects with an accuracy better than 1 µm.
Different materials, different error classes like holes, wrinkles, edge cracks, inclusions, contaminants, coating voids, scratches, spots, and dents: Our advanced filtering techniques are tailored to your needs. The easy-to-use texture inspection even adjusts necessary parameters automatically. Furthermore, even objects with reflecting surfaces can be inspected, using the principle of deflectometry.
Labels and forms printed on paper, plastic, or metal by any kind of printer: MVTec software automatically compares trained patterns with your prints. Moreover, our software provides data code print quality inspection according to ISO/IEC 15415.
Insufficient soldering paste, missing diodes, rotated components: our software detects all incomplete or incorrectly positioned parts within milliseconds.