Machine vision & AI for advanced semiconductor manufacturing
MVTec provides powerful machine vision software with integrated deep learning technologies for precise and highly automated semiconductor manufacturing. Our software supports the entire process chain – from wafer production and front-end lithography to advanced packaging and back-end assembly – with robust tools for defect detection, code reading, precision alignment, 2D/3D position recognition, wafer OCR, and metrology.
Machine vision and AI increase throughput, stabilize processes, and help manufacturers meet strict quality and yield requirements, even at high line speeds and submicron structures. They also reduce unplanned downtime by detecting defects or misaligned wafers before they can block, damage, or stop equipment.
Machine vision across the
semiconductor process chain
1. Front-End Process
Deposition, coating, lithography, etching, ion implant, CMP, cleaning, AOI & testing
Typical machine vision tasks
- High precision wafer and mask alignment
- Surface inspection for cracks, scratches, and particles
- Lithography pattern and reticle inspection
- 2D/3D wafer metrology, including topography evaluation
Reliable wafer identification with OCR and Bar & 2D Code reading
2. Advanced Packaging
RDL layer creation, µ-Bumping, interconnect formation, die-attach, underfill, encapsulation
Typical machine vision tasks
- Sub-micron alignment between stacked wafers and dies
- Fast inspection and sub-pixel-precise measurement of solder balls, bumps, pillars, pads, and RDL
- Bump height and coplanarity inspection
- Sub-surface TSV inspection
- Detection of voids and cracks in complex 3D packages
3. Back-End Process
Dicing, bonding, molding, final AOI, handling & delivery
Typical machine vision tasks
- Wafer alignment before sawing
- Dicing inspection for edge chipping or cracks
- Die-attach and bonding inspection
- Completeness checks and end-of- line AOI
[Webinar] How to maximize the yield in wafer production
Watch the webinar to discover how advanced vision technologies are transforming wafer inspection and driving quality and throughput in semiconductor manufacturing.
Key semiconductor applications enabled by MVTec software
Wafer identification with Deep OCR and 2D Code reading
Wafers must remain uniquely identifiable throughout the entire production process. Typical markings include batch numbers, dates, manufacturer codes, and other process information.
MVTec’s Deep OCR and code reading technology reliably reads characters and 2D codes even under challenging lighting, low contrast, or variable marking quality. Automatic grouping of characters into words improves recognition accuracy and reduces misreads of visually similar characters – for example, in wafer sorters and Equipment Front-End Modules (EFEMs).
Wafer AOI with defect detection
Scratches, micro-cracks, and particles directly impact yield and machine reliability.
MVTec software combines rule-based image processing with deep learning-based methods like anomaly detection to detect all kinds of defects on wafers, dies, and packages.
The software delivers robust results even on highly structured or noisy backgrounds and supports high speed and semiconductor equipment.
Redistribution layer inspection with 2D/3D metrology
Redistribution layers (RDL) are critical for interconnects between chips and substrates. Their geometry must be inspected in the micron range to ensure compliance with design rules. MVTec provides subpixel-accurate pattern matching and metrology methods for precise alignment and 2D structure measurement down to 1/50 pixel. The flexible toolbox approach enables users to select the best combination of algorithms for each inspection setup and object.
Image source: Sawyer, Brett, Yuya Suzuki, Zihan Wu, Hao Lu, Venky Sundaram, Kadappan Panayappan, and Rao Tummala. 2015. “Design and Demonstration of 40 Micron Bump Pitch Multi-Layer RDL on Panel-Based Glass Interposers.” IMAPSource Proceedings 2015 (1): 379–85. https://doi.org/10.4071/isom-2015-WP24
Bump inspection with 3D vision
Advanced packaging requires highly accurate bump structures for reliable electrical interconnects.
MVTec's 3D vision toolset supports surface-based 3D matching, 3D object processing, and 3D surface inspection for bump geometry and coplanarity checks. It handles data from various 3D sensor technologies, including electron microscopy, and provides high-speed, high-accuracy 3D metrology. Even arc and spherical surfaces can be reconstructed and analyzed precisely.
Image source: arthasarathy, Ravi, and Umut Tosun. 2023. “Defluxing of Copper Pillar Bumped Flip Chips.” IMAPSource Proceedings 2023 (DPC): 438–82. https://doi.org/10.4071/001c.90768
Precision alignment across the process chain
MVTec software performs alignment tasks in multiple semiconductor processes:
Lithography & photomask alignment
Shape-based matching aligns the current wafer position to existing patterns by precisely calculating displacement and rotation.
Probing, wafer dicing, die bonding
The orientation of the wafer can be derived from a single image. Operators in our software HALCON estimate rotation angles and ensure correct alignment before critical steps like probing or pick-and-place.
Die, ball, and wire bonding with position recognition
Precise positioning and bonding are essential for reliable electrical connections.
MVTec software provides subpixel-accurate 2D and 3D measurements and detects small positional deviations or voids, even in complex backgrounds. Cross-section profiles along local axial directions allow detailed bond analysis.
Deep learning for complex inspections
MVTec combines classical rule-based algorithms with AI methods such as deep-learning-based classification, segmentation, and anomaly detection.
This enables
- Robust defect detection in complex backgrounds
- Stable decisions despite variations in illumination or structure
- Fast adaptation to new products and process variations
This combination helps manufacturers reduce scrap, improve yield, and shorten time-to-production for new devices.
[White paper] How machine vision automates and optimizes processes in the semiconductor industry
Download the white paper and learn how to sustainably increase the efficiency of your semiconductor value creation processes.
Why MVTec HALCON is ideal
for semiconductor applications
- Full range of technologies from advanced blob analysis and matching to 3D vision and deep learning
- High-speed optimized algorithms including parallel processing and hardware/AI acceleration
- Sub-micron measurement and matching accuracy
- Proven industrial reliability for 24/7 use
- Hardware independence and seamless integration for long-term flexibility